Technical Capability Location:Home > Technical Capability > PCBA Capability

We deliver high quality surface-mount technology (SMT) products through the use of modern, well maintained SMT lines that are operated by trained professionals. Our SMT lines are capable of handling both low and high volume through-put, can perform single and double

sided component placement, mixture of SMT automatic and manual component assemblies, SMT and through-hole assemblies.

Capability: 1.SMT with 4 million placements per day
2.Manual insertion with output 500,000pcs components per day
3.Chip mounting speed is 0.3S/unit,high-point speed is 0.16S/unit
Mount Precision: 1.Chips size:Min.0201
2.Mounting precision:0.1mm
3.Multi-functional machine can match 0.3 pitch packages such as BGA,CSP

We can well done packaging LGA CBGA PBGA uBGA CSP DSP QFN LLP QFP LCC PLCC SOIC SOJ TSOP SSOP SOP SOT 1206 0805 0603 0402 0201...and so on. We also employ statistic process control methods and techniques to analyze the cause of a defect, so that we can minimize/eliminate the defects in our assemblies.

Rigao Electronics produces your products that require surface mount, through hole, BGA and mixed technology. We listen and take care of your requirement from the quotation stage through component procurement, assembly, testing , packing and shipping. All of your products will be produced in our ISO certificated manufacture. We take your orders from low volume high mix to volume production. To us, there is not thing called small order. Efficiency, flexibility and quality are our promise because we believe they are what you are looking for.

PCB Assembly Specifications
Quantity Prototype and small to middle volume are our specialty
Type of Assembly SMT and Thru-hole
Type of Service Turn-Key, Partial Turn-Key or Consignment
Solder Type Water Soluble Solder Paste, Leaded and Lead-Free
File Formats Bill of Materials
Gerber Files
Pick-N-Place File (XYRS)
Bare Board Size Smallest: 0.25 x 0.25 Inches
Largest: 20 x 20 Inches
Components Passives Down to 0201 Size
Leadless Chip Carriers/ CSP
Double-Sided SMT Assembly
BGA Repair and Reball
Part Removal and Replacement
Component Packaging Cut Tape,Tube,Reels,Loose Parts
Turn Time Same Day Service to 15 day service
Testing X-RAY Inspection & AOI Test