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Rigid PCB Capability

No.

Item

Technical data

1

Layer Count

1-30Layers

2

HDI Type

1+N+1, 2+N+2

3

Material

CEM3, FR-4, Halogen Free, Aluminum-based, Teflon,Rogers, Getek, Nelco, PTFE, Polyimide etc

4

Board thickness

0.2~5.0mm

5

Board Size

Max.

600*1000mm (24”x40”)

Min.

30x50mm

6

Copper Thickness

Outer layer

1oz~6oz

Inner layer

Hoz~5oz

7

Min. Line Width/Space

4/4mil(0.1/0.1mm)

8

Finished Hole size

Mechanical

0.20~6.30mm

Laser

5mil, 6mil

9

Blind/buried via(Mechanical)

0.2mm (min)

10

Aspect Ratio

10:1

11

Hole Dia.Tolerance

PTH

±0.075mm(3mil)

NPTH

±0.05mm (2mil)

12

Hole Position Tolerance

±0.05mm (2mil)

13

Bow & Twist

≤0.75%

14

Peel strength

1.4N/mm

15

Thermal stress

288 & 20 Sec

16

Test Voltage

50-300V

17

Soldermask color

Green, Red, Blue, Black, White

18

Silkscreen color

White, Black, Yellow

19

Min. S/M Pitch

4mil(0.1mm)

20

Min. Solder Mask Clearance

0.05mm

21

Impedance Control Tolerance

+/-10%

22

Outline Tolerance

±0.10mm (4mil)

23

Surface Finish

HASL, Lead free HASL, Immersion Gold/Tin/Silver, OSP, Flash Gold, Gold fingers, Plating Hard Gold, Carbon lnk, Peelable mask