Quality Assurance Location:Home > Quality Assurance > Quality control

At Rigao Electronics obviously quality is at the forefront of all of our Printed Circuit Board manufacturing and assembly processes. Due to we know the importance of quality when it comes to electronics. We know that our customers’ brand and reputation depend on how their products perform in the real world. For us, quality is about everything we do.


Our Quality Policy:

"Quality Always Comes First", it is our principle and responsibility to do things right at the first round. We emphasize on ‘Zero defect’ and through continuous improvement on process technique, quality control and customer services to offer the best value to meet our customers requirement with on-time delivery, reliable quality and cost effective commodities.

 
From prototypes to production, every phase is monitored and managed by the highly qualified professionals with UL, ISO, Lead-free.

Electrical Testing

Prototype Orders: We offer Flying-Probe E-Test for small volume and prototype orders. Your circuit board (PCB) is checked through a device called a Flying-Probe E-Tester. The Flying probe testers we use have few restrictions on access, require no test fixtures, and can test boards with virtually unlimited number of nets. The Tester will check for short circuits, open circuits and make sure the nets of the PCB we made is the same as the nets in your design. After testing is complete, the fail rate of your boards will be less than 1%. 

Production Orders: We use Testing fixtures to test production orders. A bed of nails tester is a traditional electronic test fixture which has numerous pins inserted into holes in an Epoxy phenolic glass cloth laminated sheet (G-10) which are aligned using tooling pins to make contact with test points on a printed circuit board.

The fixture contains an array of small, spring-loaded pogo pins; each pogo pin makes contact with one node in the circuitry of the DUT (device under test). By pressing the DUT down against the bed of nails, reliable contact can be quickly and simultaneously made with hundreds or even thousands of individual test points within the circuitry of the DUT.

The Tester will check for short circuits, open circuits, and make sure the nets of the PCB we made is the same as the nets in your design. After testing is complete, the fail rate of your boards will be less than 0.1%. 

 
RoHS
The Restriction of Hazardous Substances Directive or RoHS was adopted in February 2003 by the European Union. The RoHS directive took effect on July 1, 2006, and is required to be enforced and become law in each member state. This directive restricts the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment.
From July 1st 2006 electrical and electronic equipment introduced onto the Europe market must not contain lead, mercury, cadmium, hexavalent chromium, nor the flame retardants polybromide biphenyl, or polybromide diphenyl ether.
All our lead free finishings: Lead free HAL, Immersion silver, ENIG and OSP all comply with the RoHS requirements.

 
AOI(Automated optical inspection)
We use an AOI to check the inner layers of multi-layers PCB. AOI visually scans the surface of the PCB. The board is lit by several light sources and observed by a scanner or by a number of high definition cameras. This enables the monitoring of all areas of the board.
AOI for a bare PCB board inspection will detect these features:
        * Line width violations
  * Spacing violations
  * Excess copper
  * Missing pads.  I.e. a feature that should be on the board is missing
  * Shorts circuits
  * Cut traces or pads
  * Hole breakage.( Breakout )  I.e. a drilled hole (via) is outside of its landing pad
This inspection is much more reliable and repeatable than manual visual inspection.

 
X-Ray Inspection for BGA Assembly
Our automated X-ray inspection systems are able to monitor a variety of aspects of a printed circuit board in assembly production. The inspection is done after the soldering process to monitor defects in soldering quality. Our equipment is able to "see" solder joints that are under packages such as BGAs, CSPs and FLIP chips where the solder joints are hidden. This allows us to verify that the assembly is done right. The defects and other information detected by the inspection system can be quickly analyzed and the process altered to reduce the defects and improve the quality of the final products. In this way not only are actual faults detected, but the process can be altered to reduce the fault levels on the boards coming through. Use of this equipment allows us to ensure that the highest standards are maintained in our assembly.


In a word, the understanding that we win and lose together has always been at the heart of our business.